Tokyo, May 2009 – Fujitsu Microelectronics Limited today announced the launch of two new Consumer FCRAM memory chips. The main feature is that the operating temperature range has been extended to a high-temperature of 125°C for the first time in memory with a DDR SDRAM interface. Sample shipment of the two new FCRAM products, the 512Mbit (MB81EDS516545), and 256Mbit (MB81EDS256545), will begin from today. These products are low power consumption memory optimized for use in system-in-packages (SiPs) in digital consumer products such as digital TVs and digital video camcorders.
The main advantage in the integration of this FCRAM chips with a System-on-Chip (SoC) in a SiP configuration is that, the memory never gets affected for the change in temperature which is caused by operating speed. The other are benefits ocoes in product design, reduced board space, as well as a reduction in the number of components. The SiP configuration helps to make design easier, such as for the development of high-speed memory interfaces or for noise reduction measures.
On comparing Figure 1(a) and figure 1(b), the FCRAM products are being advanced and had resolved to the conventional memory chips. From Figure 1(a) we can understand that, on using the conventional memory chips, there is a high power consumption and the SiP temperature raises as 105°C.making the SiP to be unfeasible. But the uasge of new FCRAM can withstand upto 125°C, and makes the SiP to be feasible. On adding a heat sink to the conventional memory, the temperature may be withstood, but will increase the cost.
Fujitsu Microelectronics has responded to those needs by developing these 512Mbit and 256Mbit Consumer FCRAM products with a maximum operating temperature of 125°C. As shown in Figure 1(c), using the 125°C rated FCRAM, the SiP operates fine even with an SoC with high power consumption, and without the need to add a heat-sink. This solves the problem of increased costs for thermal measures encountered when trying to use 95°C-rated conventional memory.The FCRAM products can provide a improved data transfer rates which are more than 2 times that of the conventional DDR SDRAM memory, while keeping power consumption low for 50%. Therefore these new FCRAMs also contribute to a 50% reduction of CO2 emissions from the memory in digital consumer products (details here).
Fujitsu Microelectronics will continue to develop products with the necessary performance and functionality for SiPs in order to provide solutions for digital consumer products with optimal value and cost.
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